Effect of HEA/Al composite interlayer on microstructure and mechanical property of Ti/Mg bimetal composite by solid-liquid compound casting

In this study, HEA/Al composite interlayer was used to fabricate Ti/Mg bimetal composites by solid-liquid compound casting process. The Al layer prepared on the surface of TC4 alloy hot dipping, and FeCoNiCr HEA magnetron sputtering onto layer. influence thickness pouring temperature interface evolution investigated based SEM observation thermodynamic analysis. Results indicate that sluggish diffusion effect can effectively inhibit interfacial between Mg, which is conducive formation solid solution, especially when 800 nm. With increase from 720 °C 730 °C, 740°C, 750 ?-Al(Mg), ?-Al(Mg)+Al3Mg2, Al3Mg2+Al12Mg17, Al12Mg17+?-Mg are formed at bimetal, respectively. When nm bonding strength reach maximum 93.6 MPa.